CHIP ENCAPSULANTS

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CHIP ENCAPSULANTS – PRODUCTS AND SPECIFICATIONS

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Glob top UV adhesive of COB(Chip on Boad)

  • Thermal limit is good(-40℉ to 356℉ (-40℃ to 180℃))
  • Dielectric Strength
  • Long self life (over 1 year)
  • Good adhesion for flexible PCB (Polyimide)
  • High ionic purity
  • High speed cure by UV/Visible
  • Heat resistance is good
  • 100% Non-solvent type

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chip-encap-chart-eng-14-01

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